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Equipment Angency
Semicon Equipment Maintenance Service
 
 
   晶片失效分析 →
Decapsulation
SEM&EDX
Probe Station Application
EMMI Application
OBIRCH Application
LC Application
IC Grinding:Positioned/None-positioned
De-Gold Bump
X-Ray Application
SAM Application
去金球
De-Gold Bump

移除植於液晶驅動晶片 Pad上的金凸塊, 保持Pad完好無損, 以利後續分析或rebonding.

 
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